Status : Published
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Abstract

This document defines the relevant properties for coupling lightwaves into and out of integrated optical chips (IOC) and chips with photonic integrated circuits (PIC). This document mainly focuses on butt coupling via the waveguide endfaces. The definitions provide the basis for specifying the elements to be coupled (e. g. fibres, integrated optical chips) related to coupling properties.

General information

  • Status
     : Published
    Publication date
     : 2021-10
    Stage
    : International Standard published [60.60]
  • Edition
     : 2
    Number of pages
     : 9
  • Technical Committee :
    ISO/TC 172/SC 9
    ICS :
    31.260 
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