ISO/CD TS 25336

Projet

Examen du projet par le comité en cours.

Résumé

This proposal relates to a method for testing the low-temperature cracking index test of thermosetting resin based material for power electronic equipment.The corresponding molds, stress module and sample preparation are also described. The test method described in this proposal is suitable for quantifying and comparing the low-temperature cracking of thermosetting resin based material in laboratory settings. This document does not refer to thermosetting resin based materials that may also crack at 0 °C and above.