Abstract

ISO 9453:2014 specifies the requirements for chemical composition for soft solder alloys containing two or more of tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.


General information 

  • Status
     :  Withdrawn
    Publication date
     : 2014-08
  • Edition
     : 3
    Number of pages
     : 16
  • Technical Committee
     : ISO/TC 44/SC 12 Soldering materials
  • ICS
     :
    25.160.50 Brazing and soldering

Life cycle


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