Abstract
PreviewThis document specifies a method for measuring the thermal resistance between a heater chip and a cold plate with the heater chip mounted on a metalized ceramic substrate, imitating a silicon carbide (SiC) high-output power module. This measurement represents an index of the heat dissipation characteristics of a metallized ceramic substrate used in a high-output power module.
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Status: PublishedPublication date: 2023-01
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Edition: 1Number of pages: 12
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- ICS :
- 81.060.30 Advanced ceramics
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Format | Language | |
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std 1 61 | PDF + ePub | |
std 2 61 | Paper |
- CHF61
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