Status : Under development
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Abstract

This part of ISO 9455 specifies test methods of cleanliness of the Soldered Printed Circuit Assemblies before and/or after cleaning. The test is applicable to all fluxes as defined in ISO 9454-1.

General information

  • Status
     : Under development
    Stage
    : Close of voting [40.60]
  • Edition
     : 1
    Number of pages
     : 12
  • Technical Committee :
    ISO/TC 44/SC 12
    ICS :
    25.160.50 
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Life cycle

Sustainable Development Goals

This standard contributes to the following Sustainable Development Goal

9
Industry, Innovation and Infrastructure

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